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NCV8855
PIN FUNCTION DESCRIPTIONS
Pin No.
Symbol
Description
LOW DROPOUT LINEAR REGULATOR CONTROLLER 1 (LDO1) PIN CONNECTIONS
38
1
40
39
LR_FB1
LR_G1
ISNS1+
ISNS1 ?
LDO controller output voltage feedback pin. Connect a resistor divider network to VOUT3 to set the desired
output voltage.
Error amplifier output of the LDO controller. Connect to gate of P ? Channel MOSFET pass element.
Current sense positive input. Connect this pin to the supply side of the current sense resistor. This pin also
serves as the supply rail for the linear regulator controller. A local bypass capacitor with a value of 0.1 m F to 1
m F is recommended.
Current sense negative input. When using a current sense resistor, connect this pin to the pass element side
of the current sense resistor. If current limit is not used, connect this pin to the supply rail of the pass element.
LOW DROPOUT LINEAR REGULATOR CONTROLLER 2 (LDO2) PIN CONNECTIONS
34
33
31
32
LR_FB2
LR_G2
ISNS2+
ISNS2 ?
LDO controller output voltage feedback pin. Connect a resistor divider network to VOUT3 to set the desired
output voltage.
Error amplifier output of the LDO controller. Connect to gate of P ? Channel MOSFET pass element.
Current sense positive input. Connect this pin to the supply side of the current sense resistor. This pin also
serves as the supply rail for the linear regulator controller. A local bypass capacitor with a value of 0.1 m F to 1
m F is recommended.
Current sense negative input. When using a current sense resistor, connect this pin to the pass element side
of the current sense resistor. If current limit is not used, connect this pin to the supply rail of the pass element.
HIGH ? SIDE LOAD SWITCH (HSS) PIN CONNECTIONS
26
28
VIN
HS_S
This pin is the supply rail for the internal high ? side load switch, DRV_VPP and 5V_IC. Bypass this pin with a
1 m F ceramic capacitor.
Source node output of the internal high ? side N ? Channel MOSFET load switch.
MAXIMUM RATINGS (Voltages are with respect to AGND unless noted otherwise)
Pin Name
Max dc voltage (GH1, BST1, SN1, SN2, BST2, HS_S)
Negative Transient (t < 50 ns) (SN1, SN2)
Max dc voltage: 5V_IC
Max dc voltage: DRV_VPP
Max dc voltage (BST1 & GH1w/respect to SN1, GL1, BST2 w/respect to SN2)
Max dc voltage (OCSET, ISNS1+, ISNS1 ? , LR_G1, VIN, VIN_SW, ISNS2+, ISNS2 ? , LR_G2)
Peak Transient (ES ? XW7T ? 1A278 ? AB Test Pulse G – Loaded Conditions)
(OCSET, ISNS1+, ISNS1 ? , LR_G1, VIN, VIN_SW, ISNS2+, ISNS2 ? , LR_G2)
Max dc voltage (SW_FB1, COMP1, LR_FB1, LDO_EN, HOT_FLG, SW_FB2, COMP2, LR_FB2, HS_EN,
SYS_EN, SYNC)
Max dc voltage: PGND
Maximum Operating Junction Temperature Range, T J
Maximum Storage Temperature Range, T STG
Peak Reflow Soldering Temperature: Pb ? Free
60 to 150 seconds at 217 ° C
Value
? 0.3 to 30
? 2
6
9
? 0.3 to 15
? 0.3 to 40
? 0.3 to 45
? 0.3 to 7
? 0.3 to 0.3
? 40 to 150
? 55 to +150
260 peak
Unit
V
V
V
V
V
V
V
V
V
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
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